Companies

Apple In Talks With Indian Chipmakers To Assemble, Package iPhone Components: Report

December 17, 2025

Apple is in preliminary discussions with Indian chipmakers to assemble and package components for iPhones, marking a strategic shift to diversify its manufacturing operations away from China. The talks reportedly involve CG Semi, a subsidiary of the Murugappa Group, which is developing an OSAT facility in Gujarat.

Apple In Talks With Indian Chipmakers To Assemble, Package iPhone Components: Report

Credit: Feedburner

Key Highlights

Apple aims to diversify its supply chain by collaborating with Indian semiconductor manufacturers.
Discussions are focused on assembling and packaging iPhone chips in India for the first time.
The Sanand facility in Gujarat is expected to handle display-related chips.
Apple plans to shift the manufacturing of iPhones sold in the US to India by the end of 2026.

technology

Sources

This quick summary is automatically generated using AI based on reports from multiple news sources. The content has not been reviewed or verified by humans. For complete details, accuracy, and context, please refer to the original published articles.

Apple In Talks With Indian Chipmakers To Assemble, Package iPhone Components: Report

Key Highlights

Sources

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